Polysilicon,Polysilicon,has,gr business, insurance Polysilicon

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Polysilicon has gray metallic luster,density is 2.32 to 2.34, melting point is 1410,boiling point is 2355.Can dissolve in mixed hydrofluoric acid and nitric acid, does not dissolved inwater, nitric acid and hydrochloric acid. Hardness between germanium andquartz, crisp at room temperature and easily broken while cutting. Heated toabove 800 can with ductility,at 1300 showsignificant deformation. At room temperature is inactive, at high temperature canreact with oxygen, nitrogen, sulfur, etc. At high-temperature molten state,have greater chemical reactivity, can react with almost any materials. Havesemiconductor properties, is extremely important excellent semiconductormaterials, but small amounts of impurities can greatly affect its conductivity.In the electronics industry are widely used as basic materials in manufacturingtransistor radios, tape recorders, refrigerators, color TV, VCR, computer, etc.Obtain from dry silicon powder and dryhydrogen chloride gas chlorination, condensation, distillation, reduction undera certain condition.Polysilicon is a form of elemental silicon.While the molten elemental silicon freezing under subcooled conditions, siliconatoms are arranged in diamond lattice patterns in many crystal nucleus, such asthese crystal nucleus grow into different crystal plane orientation crystallinegrains, these grains combined can crystallize into polysilicon. Polysilicon canuse as the raw materials of monocrystalline silicon, the differences between polycrystallinesilicon and monocrystalline silicon mainly in physical properties. For example,in anisotropy of mechanical properties, optical properties and thermalproperties, it is far less the monocrystalline obviously; polysilicon crystal’sconductivity also far less than monocrystalline significantly in electricalproperties, even almost no conductivity. In chemical activity, the differenceis minimal. Polysilicon and monocrystalline silicon can be distinguished fromthe appearance, but the real differential shall be determined by analyzing thecrystal direction of the crystal surface, conductivity type and resistivity.According to metal powder supplier, polysiliconproduction for environmental and equipment cleaning requirements is very high.The production process is more complicated. Especially the equipment impact onthe quality of the product is extremely important. In order to ensure thequality of products, in the equipment installation process, the cleaning ofequipment and piping and other important equipment must be very strict. In thecleaning process, make every aspect of quality are up to par. According to differentprocess requirements, different material of the device as well as differenttypes of devices, cleaning processing requirements and the achieved basicstandards (require to achieve no oil, anhydrous and dust-free threerequirements).Polysilicon equipment cleaning is mainlythe pickling, degreasing, passivation, drying, etc. wherein the most important isthe degreasing process and drying technology. Grease and water have a hugeimpact on polysilicon products. So that in polysilicon equipment cleaning,degreasing process and drying process is the point. Mainly have cleaninghydrogenation furnace, CDI equipment, reduction furnace, synthesis workshop,reductive hydrogenation plant, distillation systems, intermediate tanks,pipelines and other major equipment. And in order to ensure the quality ofdegreasing and drying, the polysilicon equipment need to clean on a singlepiece of equipment and single installation after acceptance.Device’s residual dirt on the polysilicon haveadversely affected, Grease: in the polysilicon producing process, the hazardsof the oil molecules for polysilicon is very serious. The actual proven that afew millionths of oil content may cause entire polysilicon reaction processsystem slower, lower production, even stopping silicon reaction. Therefore, thepolysilicon equipment degreasing process is particularly important. Moisture content:the water contained a lot of chlorine ion, chloride ion is very sensitive forpolysilicon reactions. Residual chloride ions: the effect of water and othersolutions residual chlorine ions in the device surface for polysilicon is verylarge. Therefore, after cleaning, the process of water rinsing the device isvery important. Oxides, dust and other impurities: the presence of other dirt, alsohave a great impact on polysilicon production. Therefore, in equipment cleaningprocess, use the pickling process to clean other dirt is necessary.Source:http://www.mhcmp.com