DRAM,Makers,Try,Catch,with,Sam technology DRAM Makers Try to Catch up with Samsung in Manufacturing Te
The electronic cigarette is not new. People who buy electronic cigarette knows that this product has been in the market for years now. Despite some sectors apparently trying to shoot the product down from the shelves, the popularity of elect Active shredder safety technology for the small office. Shreds 15sheets per pass into 5/32" x 1-1/2" cross-cut particles (Security Level3). Patented SafeSense® Technology stops shredding when hands touch thepaper opening. Designated shredde
In the third quarter, Samsungs waferproduction at the 3x/2x level gets 29% of the market, which is the highestlevel among all major DRAM makers so far. Samsung is still being the leader inthis field, and until the end of 2012, Samsung will turn nearly 80% waferproduction to 3x nm or even more advanced process technologies.The fellow South Koreancompetitor, Hynix Semiconductor Inc. wants to catch up with Samsung, and Hynixcounts 18% of DRAM production at the same 3x/2x nm level, while although its 25nm products are still being the early testing stage, Japans Elpida Memory Inc.ranked the third and takes 16 percent. Although Hynix and Elpidathe second-and third-ranked entities in revenue market share for the DRAM spacehave notapproached Samsungs efficiency in migrating process nodes downward morequickly, such percentage levels suggest an effort to keep up.While, Micro and Nanya, the current laggardswill be hurry their pace to catch up at the end of the next year. At present,the main products of these two companies still depend on 42 nm process whoseprobably cost effective might be kept only for this year. And then, in order tostay competitive, the two companies will need to accelerate their transition to3xnm.Since the present DRAM prices are still low,entities, like Powerchip, still adopt 4x/5xnm electronic components processes,and according to iSuppli, production at those nodes means a decreasinglikelihood of even covering cash costs. The cash cost per packaged 2Gb DDR3 dieat 31nm currently stands at $0.68, but the cash cost balloons to $1.34 at 48nm.It is expected that the average selling prices for DRAM might slide evenfurther, and in the Q4, it might be down to $1.25. So, any player who continuesto produce at the 4xnm node is easy to confront disaster.To overcome this difficulty, manufacturersneed to move quickly and transition process nodes downward. However, thisaction might bring in some side effect that more DRAM per wafer will beproduced as industry players struggle to keep up in the downward-migrationrace, which is likely to press the prices even more.
DRAM,Makers,Try,Catch,with,Sam